3 step process with rework pdf

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Homepage | IPC International, Inc. more detailed hypothetical case study involves a chromatography step and provides a data-driven il- lustration of how the depth and quantity of product/process knowledge influences the reprocessing approach including the regulatory strategy. The inspection step catches 80% of all defects. From inspection, units that are deemed to be non-defective are moved to the shipping department. If a defect is found at inspection, it is sent to the rework department. Rework fixes about 95% of the defective units. Calculate the yield (number out of step/number into step) of each step. Multiply these together. For example: (# units leaving the process as good parts) / (# units put into the process) = FTY 100 units enter A and 90 leave as good parts. The FTY for process A is 90/100 = 0.9000 90 units go into B and 80 leave as good parts. For example, you have a 3-step process for producing labels. The labels are printed, laminated, then cut. You want to calculate the throughput yield at each step of the process. First, 1000 labels go to the printing process, and 950 of the printed labels are acceptable. The throughput yield of the printing process is 95%. 1. List the most basic steps in the process. Limit yourself to no more than 5 or 6 basic steps and place them in order horizontally across a whiteboard, flipchart or large piece of paper. 2. Under each step, list the sub-steps that make up that element, list them in the order they occur and again, limit yourself to 5 or 6 sub-steps. Hierarchy of Process Discovery This is the evolution of detail of analysis: 1. SIPOC—to provide high-level scoping of the process 2. Swimlane Diagram—to document process steps, and illustrate wastes of hand-offs 3. Value Stream Map—to identify product, process, and information flows with value-add percentage 4. Process Map—to illustrate Then the BSI wafer process flow was performed at imec. The BSI DAVIS processing consisted of the following steps [100]: bonding the standard CMOS wafer front side to a carrier wafer, flipping the Is the agreed quality of the purchased parts guaranteed? 5.3. Is the quality performance evaluated and are corrective actions introduced when there are. deviations from the requirements? 5.4. Are target agreements for continual improvement of products and process made and implemented. with the suppliers? 5.5. the bpi problem solving analysis is the process to use to determine the cause of special cause variation. 4] once you understand how the non-conformance is being created, use the bpi decision making analysis to decide how best to protect your customer from future non- conformances. 5] share your protection plan with your customer in the detection … Once you break down the process steps and diagram them, problem areas become more visible. It is easy to spot opportunities for simplifying and refining your process by analyzing decision points, redundant steps, and rework loops.! Depict customer-supplier relationships, helping the process workers to understand who their customers are, and how they may sometimes act as suppliers and sometimes October